IBS Institute for Basic Science
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공지사항

Co-sputtering system

equipment explanation
Model Customized
Operating time MON(00:00~24:00)
TUE(00:00~24:00)
WED(00:00~24:00)
THU(00:00~24:00)
FRI(00:00~24:00)
Location 86391
inquiry Moonyoung Jung
010-5669-8370
my.jung8370@gmail.com
Reservation

Notice

 

Available Time // Except Sat, Sun.

 

Notice // If you want to have training for using this equipment, please contact Super-user.

 

Current Status // Now on operation. 

Physical vapor deposition (PVD) method of thin film deposition by sputtering.


Sputter gun assembly
1. Target size : 46mm OD x 3 mm thick
2. Backing plate: 50mm OD x 3 mm thick
3. Magnetic material Fe : 1.0mm thick ; Ni : 3mm thick
4. Erosion diameter SW: 46mm, PP: 40mm
5. Internally mounted on a 25.4OD 300mm long shaft
6. Includes diaphragm indirect cooling for High power operation
7. Quick target change
8. Shaft length modification to length 500mm
9. Gas Injection Option 2\\\" Circular Magnetron. Atmospheric side connection
10. Shutter option for 2\\\" circular magnetron source. Includes sliding flexible shaft and shutter shaft feedthrough with pneumatic actuator (no solenoid value included)
11. Supplement for tiliting head option. ±30 Degree adjustable at vacuum side
12. Supplement for high power RF option for SW100 circular magnetron. Includes RF cage with a copper strip to direct connection for matching box
(matching box mounting interface is not included) or connection to C-ES25 electrical shield box."
13. Wall mount feed through for 25.5mm OD internal shaft mount circular magnetron